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LAMP
204-15/T2C3-4LQA
 
 
8 
Copyright ?2010, Everlight All Rights Reserved. Release Date : May. 03, 2013. Issue No: DLE-0001234_Rev.4
www.everlight.com 
 
204-15/T2C3-?/SPAN> ?/SPAN> ?/SPAN> ?/SPAN> 
 
 
 
 
 
 
 
 
 
1.   Lead Forming
    During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
    Lead forming should be done before soldering.
    Avoid stressing the LED package during leads forming. The stress to the base may damage the LEDs
characteristics or it may break the LEDs.
    Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of
the LEDs.
    When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED.
If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade
the LEDs.
2.   Storage
    The LEDs should be stored at 30?C or less and 70%RH or less after being shipped from Everlight and the
storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a
sealed container with a nitrogen atmosphere and moisture absorbent material.
    Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where
condensation can occur.
3.   Soldering
    Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to
epoxy bulb, and soldering beyond the base of the tie bar is recommended.
 
    Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
300    Max. (30W
Max.)
Preheat temp.
100      Max.   (60   sec
Max.)
Soldering time
3 sec Max.
Bath temp. & time
260 Max., 5 sec Max
Distance
3mm Min.(From
solder joint to epoxy
bulb)
Distance
3mm Min. (From solder
joint to epoxy bulb)
 
 
 
 
Color Group
Luminous Intensity Bins
Voltage Group
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